Mark is engineering director,
Enclosure Solutions, responsible for directing innovation efforts in wireless communications
enclosure systems for CommScope, with particular focus on thermal design, power
systems and other efficiency drivers. He brings
30-plus years of expertise in electronic packaging, with backgrounds in both defense
electronics and telecommunications for such names as Texas Instruments, Fujitsu and Xtera
Communications. Mark holds 12 U.S. patents and is a registered professional engineer in the state
of Texas. He holds a Bachelor of Science degree in mechanical engineering from
Clemson
University, and a Master of Science degree in mechanical engineering from
Southern Methodist University.
