B2BYM-PI
1.5-3.5 Male Straight B2B, Press-In Type on Filter
Specifications
Product Classification
Product Type | Device connector |
General Specifications
Body Style | Straight |
Inner Contact Attachment Method | Solder |
Inner Contact Plating | Silver |
Interface | 1.5-3.5 Male |
Mounting Angle | Straight |
Outer Contact Plating | Trimetal |
Dimensions
Height | 7.8 mm | 0.307 in |
Width | 7.8 mm | 0.307 in |
Length | 13.5 mm | 0.531 in |
Diameter | 7.8 mm | 0.307 in |
Outline Drawing
Click on image to enlarge. |
Electrical Specifications
3rd Order IMD at Frequency | -110 dBm @ 3500 MHz | -117 dBm @ 1800 MHz | -117 dBm @ 2600 MHz | -117 dBm @ 910 MHz |
3rd Order IMD Test Method | Two +43 dBm carriers |
Insertion Loss, maximum | 0.1 dB |
Connector Impedance | 50 ohm |
dc Test Voltage | 1000 V |
Inner Contact Resistance, maximum | 2 mOhm |
Insulation Resistance, minimum | 5000 mOhm |
Operating Frequency Band | 0 – 6000 MHz |
Outer Contact Resistance, maximum | 2 mOhm |
RF Operating Voltage, maximum (vrms) | 500 V |
Return Loss/VSWR
Frequency Band | VSWR | Return Loss (dB) |
450–2200 MHz | 1.065 | 30.04 |
2200–3800 MHz | 1.065 | 30.04 |
3800–4200 MHz | 1.083 | 27.99 |
4200–6000 MHz | 1.222 | 20.01 |
Mechanical Specifications
Insertion Force | 15 N | 3.372 lbf |
Interface Durability | 100 cycles |
Interface Durability Method | IEC 61169-4:17 |
Mechanical Shock Test Method | IEC 60068-2-27 |
Radial Float/Misalignment | 2.7 ° |
Environmental Specifications
Operating Temperature | -55 °C to +85 °C (-67 °F to +185 °F) |
Storage Temperature | -65 °C to +125 °C (-85 °F to +257 °F) |
Attenuation, Ambient Temperature | 20 °C | 68 °F |
Average Power, Ambient Temperature | 40 °C | 104 °F |
Average Power, Inner Conductor Temperature | 100 °C | 212 °F |
Corrosion Test Method | IEC 60068-2-11 |
Thermal Shock Test Method | IEC 60068-2-14 |
Vibration Test Method | IEC 60068-2-6 |
Packaging and Weights
Weight, net | 1.66 g | 0.004 lb |
Product Classification
Product Type | Device connector |
General Specifications
Body Style | Straight |
Inner Contact Attachment Method | Solder |
Inner Contact Plating | Silver |
Interface | 1.5-3.5 Male |
Mounting Angle | Straight |
Outer Contact Plating | Trimetal |
Dimensions
Height | 7.8 mm | 0.307 in |
Width | 7.8 mm | 0.307 in |
Length | 13.5 mm | 0.531 in |
Diameter | 7.8 mm | 0.307 in |
Electrical Specifications
3rd Order IMD at Frequency | -110 dBm @ 3500 MHz | -117 dBm @ 1800 MHz | -117 dBm @ 2600 MHz | -117 dBm @ 910 MHz |
3rd Order IMD Test Method | Two +43 dBm carriers |
Insertion Loss, maximum | 0.1 dB |
Connector Impedance | 50 ohm |
dc Test Voltage | 1000 V |
Inner Contact Resistance, maximum | 2 mOhm |
Insulation Resistance, minimum | 5000 mOhm |
Operating Frequency Band | 0 – 6000 MHz |
Outer Contact Resistance, maximum | 2 mOhm |
RF Operating Voltage, maximum (vrms) | 500 V |
Return Loss/VSWR
Frequency Band | VSWR | Return Loss (dB) |
450–2200 MHz | 1.065 | 30.04 |
2200–3800 MHz | 1.065 | 30.04 |
3800–4200 MHz | 1.083 | 27.99 |
4200–6000 MHz | 1.222 | 20.01 |
Mechanical Specifications
Insertion Force | 15 N | 3.372 lbf |
Interface Durability | 100 cycles |
Interface Durability Method | IEC 61169-4:17 |
Mechanical Shock Test Method | IEC 60068-2-27 |
Radial Float/Misalignment | 2.7 ° |
Environmental Specifications
Operating Temperature | -55 °C to +85 °C (-67 °F to +185 °F) |
Storage Temperature | -65 °C to +125 °C (-85 °F to +257 °F) |
Attenuation, Ambient Temperature | 20 °C | 68 °F |
Average Power, Ambient Temperature | 40 °C | 104 °F |
Average Power, Inner Conductor Temperature | 100 °C | 212 °F |
Corrosion Test Method | IEC 60068-2-11 |
Thermal Shock Test Method | IEC 60068-2-14 |
Vibration Test Method | IEC 60068-2-6 |
Packaging and Weights
Weight, net | 1.66 g | 0.004 lb |
Click on image to enlarge. |
Documentation & Downloads
Product Specification
Warranty
Product Compliance Documentation
Product Specification
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