At CommScope, technology keeps evolving.  The SYSTIMAX® Ultra High Density Shelf was released to the data center market this year.  It has an amazing capacity of 144 fibers with LC connectors.  This density will solve many problems with high density collocation and blade server environments.

 

SYSTIMAX 72-Fiber 1U Shelf

 

This innovation has made me think back to how density has improved over time.  The 1U shelves that I installed early in my career only held two  panels with 12 SC connectors for a total of only 24 fibers.  The LC connector and increased density led to three  panels per 1U  with a density of 72 fibers, which was considered “high-density”.  That was just a few years ago.
Today, 72 fibers are seen as typical density.


 

 

SYSTIMAX 96-Fiber Shelf

 

 


To be considered high-density today, a shelf must now accommodate 96 LC connectors.  Now, CommScope has raised the bar to a new level, as its UHD shelf has a full 50 percent higher density compared to what’s available in the market today.

 

The UHD high density shelf has some other compelling features, too.

 


  • You only need three modules to reach capacity.

  • It’s available fully loaded or empty.

  • There’s great patch cord management control that is located on the sides.

  • And, it features labeling with magnification.


Of course, all of that connectivity in one shelf is no good if you can’t get your hands in there to work or manage the patch cords.  That’s why this UHD can be pulled out from the rack and each module can be lifted out of the way to access the connectors below.

 

If density is a primary need, I believe the CommScope UHD shelf should be your number one choice.


View more presentations from CommScope.

 

About the Author

Eric Leichter

Eric Leichter is director for business development for CommScope Mobility Solutions, focused on fiber and power solutions for remote radio deployments. He has over 15 years of experience with telecommunications and optical fiber solutions, including roles supporting application and field engineering, product management, standards and training. While supporting a mix of wireless, data center, campus, and outside plant applications, Eric has experience with a multitude of vendor and generic solutions sets. He is a multiple patent holder, has provided several dozen published articles and conference presentations, and is a LEED Green Associate. Eric has an engineering degree from Virginia Polytechnic Institute and State University (Virginia Tech) and an MBA from Gardner-Webb University.

See all posts by this author

Add Your Comment

Please submit your comment using the form below

 
(required)