Do you know what causes PIM around your antennas?

Janice Conklin_ektron Janice Conklin December 17, 2018

2018_CommScope_PIM_Tessco_SnaptakExternal passive intermodulation (PIM) has always been a concern in wireless networks; however, it has become even more of a challenge with the introduction of wide-band systems to support new 4G and 5G technologies. In the simplest definition, PIM is caused when two or more wireless signals mix together and create additional frequencies which cause interference and can significantly deteriorate network performance.

CLICK TO TWEET: Let CommScope and Tessco show you how to reduce PIM in your network.

Operators are now discovering that elevated levels of external PIM can be generated around antennas by certain products which have been used in industry standard installation practices for years.

With consumers demanding higher speeds and greater performance, operators are working furiously to add more bandwidth and new frequencies - many of which are more vulnerable to PIM effects. To further exacerbate the PIM issue, this is causing tower top mount configurations to become even more littered with antenna, radio and cable support connections. This creates an even greater potential for disruptive wireless harmonics in the PIM critical zone around the antenna.

CommScope understands PIM and has worked with operators to design and thoroughly test a full PIM-guard family of solutions to eliminate potential PIM sources. Recently, Dale Heath, product line manager, CommScope, presented on a Tessco webinar “PIM Mitigation Solutions with CommScope.” In this webinar, Dale discusses the causes of and how to reduce and eliminate PIM in the network. We encourage you to watch this on-demand webinar.

After participating in the webinar, please use the comment section below for any follow up questions you might have about PIM.

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About the Author

Janice Conklin_ektron

Janice Conklin

Janice Conklin is a Product Line Manager supporting the Structural Support Products Group based at the Steel Division engineering and manufacturing facility in Euless, TX.  Ms. Conklin has been with CommScope for two years and brings with her over 20 years of experience in product and project management across various industries. This experience includes 15 years in the telecommunications industry with Corning and Time Warner along with 8 years of experience in logistics and OCR-based process automation with BancTec and Siemens. Ms. Conklin graduated Suma Cum Laude from Texas Christian University in Fort Worth, Texas with a Bachelor’s degree in Management. She also holds an MBA from the University of Texas at Arlington and is a Certified Product Manager.